Electronic interface apparatus and method and system for manufacturing same

ABSTRACT

A method for manufacture of an electronic interface card ( 100 ) including defining a pair of apertures in a substrate layer ( 116 ), associating an antenna ( 112 ) with the substrate layer ( 116 ) such that opposite ends of the antenna ( 112 ) terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer ( 114 ) and a bottom layer ( 118 ), forming a recess ( 122 ) in the top layer and the substrate layer, attaching end of connection wires ( 130 ) to the metal elements, attaching opposite ends of the connection wires ( 130 ) to a chip module ( 120 ) and sealing the chip module in the recess ( 122 ).

FIELD OF THE INVENTION

The present invention relates to electronic interface cards, also known as “smart cards” generally and more particularly to electronic interface cards having contact and/or contact-less functionalities.

BACKGROUND OF THE INVENTION

The following U.S. patents are believed to represent the current state of the art:

U.S. Pat. No. 7,278,580; U.S. Pat. No. 7,271,039; U.S. Pat. No. 7,269,021; U.S. Pat. No. 7,243,840; U.S. Pat. No. 7,240,847 and U.S. Pat. No. 7,204,427.

SUMMARY OF THE INVENTION

The present invention seeks to provide improved electronic interface cards and methods for manufacturing thereof.

There is thus provided in accordance with a preferred embodiment of the present invention, a method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer and a bottom layer, forming a recess in the top layer and the substrate layer, attaching ends of connection wires to the metal elements, attaching opposite ends of the connection wires to a chip module and sealing the chip module in the recess.

Preferably, the method also includes providing a first additional substrate layer and a second additional substrate layer onto the underside of the substrate layer prior to the laminating. Additionally or alternatively, the top layer includes a first top substrate layer and a second top substrate layer. Additionally, the method also includes exposing a recessed surface of the second top layer adjacent the recess and the sealing includes placing an adhesive on an underside of the chip module and inserting the chip module into the recess such that the underside engages the recessed surface.

Preferably, the method also includes folding the wires underneath the chip module. Additionally or alternatively, the method is automated.

Preferably, the attaching ends of connection wires to the metal elements includes laser bonding. Additionally or alternatively, the attaching opposite ends of the connection wires to a chip module includes soldering.

Preferably, the wires have a length substantially greater than the distance between their respective opposite ends in the electronic interface card.

There is also provided in accordance with another preferred embodiment of the present invention a method for manufacture of an electronic interface card including forming a substrate having at least one layer, forming an antenna in the at least one layer, forming a recess in the at least one layer, connecting wires between a chip module and the antenna and mounting the chip module in the recess.

Preferably, the wires have a length substantially greater than the distance between their respective opposite ends in the electronic interface card. Additionally or alternatively, the connecting wires includes connecting the antenna to metal elements and connecting the wires to the metal elements. Additionally or alternatively, the mounting including folding the wires underneath the chip module.

Preferably, the method is automated.

There is further provided in accordance with yet another preferred embodiment of the present invention an electronic interface card including a substrate, a wire antenna associated with the substrate, a chip module mounted in a recess formed in the substrate and wires providing electrical connections between the chip module and the wire antenna.

Preferably, the chip module includes a packaged smart card chip. Additionally or alternatively, the wires are folded underneath the chip module in the recess. Additionally or alternatively, the wires have a length substantially greater than the distance between their respective opposite ends in the electronic interface card.

There is still further provided in accordance with still another preferred embodiment of the present invention a system for manufacturing an electronic interface card based on an electronic interface assembly including a substrate having at least one layer, at least two metal elements located in the at least one layer and a wire antenna associated with the substrate and having ends electrically coupled to the at least two metal elements, the system including a laminator operative to laminate the substrate layer together with a top layer and a bottom layer, a recess former operative to form a recess in the top layer and the substrate layer, a first wire attacher operative to attach ends of connection wires to the metal elements, a second wire attacher operative to attach opposite ends of the connection wires to a chip module and a sealer operative to seal the chip module in the recess.

Preferably, the first wire attacher is a laser bonding wire attacher. Additionally or alternatively, the second wire attacher is a soldering wire attacher.

There is even further provided in accordance with another preferred embodiment of the present invention an electronic interface assembly including a substrate having at least one layer, at least two metal elements located in the at least one layer and a wire antenna associated with the substrate and having ends electrically coupled to the at least two metal elements.

There is yet further provided in accordance with yet another preferred embodiment of the present invention a method for manufacture of an electronic interface assembly including providing a substrate having at least one substrate layer, associating an antenna with the at least one substrate layer and connecting opposite ends of the antenna to metal elements associated with the substrate.

Preferably, the method also includes defining a pair of apertures in a substrate layer such that opposite ends of the antenna terminate at the apertures and placing the metal elements in each of the apertures prior to the connecting. Additionally or alternatively, the method also includes laminating the substrate layer together with a top layer and a bottom layer. Additionally, the method also includes forming a recess in the top layer and the substrate layer, attaching ends of connection wires to the metal elements, attaching opposite ends of the connection wires to a chip module and sealing the chip module in the recess.

Preferably, the attaching ends of connection wires to the metal elements includes laser bonding. Additionally or alternatively, the attaching opposite ends of the connection wires to a chip module includes soldering.

Preferably, the method is automated.

There is also provided in accordance with still another preferred embodiment of the present invention an electronic interface assembly including a substrate having at least one layer, at least two terminals located in the at least one layer, a wire antenna associated with the substrate and having ends electrically coupled to the at least two terminals, a chip module mounted in a recess formed in the substrate, and wires providing electrical connections between the chip module and the wire antenna, the wires having a length substantially greater than the distance between their respective opposite ends in the electronic interface assembly.

Preferably, the chip module includes a packaged smart card chip. Additionally or alternatively, the wires are folded underneath the chip module in the recess.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawings in which:

FIG. 1 is a simplified pictorial and sectional illustration of an electronic interface card having both contact and contact-less functionalities, constructed and operative in accordance with a preferred embodiment of the present invention;

FIG. 2 is a simplified pictorial illustration of an initial step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 3A and 3B are, respectively, simplified pictorial and sectional illustrations of a further step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 4A and 4B are, respectively, simplified pictorial and sectional illustrations of a yet further step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 5A and 5B are, respectively, simplified pictorial and sectional illustrations of a still further step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 6A and 6B are, respectively, simplified pictorial and sectional illustrations of an additional step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 7A and 7B are, respectively, simplified pictorial and sectional illustrations of a further additional step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 8A and 8B are, respectively, simplified pictorial and sectional illustrations of a yet further additional step in the manufacture of the electronic interface card of FIG. 1;

FIGS. 9A and 9B are, respectively, simplified pictorial and sectional illustrations of a still further additional step in the manufacture of the electronic interface card of FIG. 1; and

FIGS. 10A and 1013 are, respectively, simplified pictorial and sectional illustrations of a final step in the manufacture of the electronic interface card of FIG. 1.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT

Reference is now made to FIG. 1, which illustrates an electronic interface card 100 having contact and/or contact-less functionalities, constructed and operative in accordance with a preferred embodiment of the present invention. As seen in FIG. 1, electronic interface card 100 preferably comprises a multiple-layer substrate including top and bottom protection layers 102 and 104, typically formed of PVC (PolyVinyl Chloride), each typically of thickness 0.05 mm. Alternatively, protection layers 102 and 104 may be formed of any other suitable material, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS.

Disposed inwardly of both of protection layers 102 and 104 are preferably artwork layers 106 and 108, typically formed of PVC, each typically of thickness 0.15 mm, typically bearing artwork which is visible through respective protection layers 102 and 104. Alternatively, artwork layers 106 and 108 may be fowled of any suitable material, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS. Alternatively, artwork layers 106 and 108 may be obviated.

Disposed inwardly of both of artwork layers 106 and 108 there is preferably provided an inlay 110 including a wire antenna 112, preferably of wire diameter 0.1 mm, embedded in a first inlay layer 114, typically formed of PVC, preferably of thickness 0.15 mm. Inlay 110 also includes second and third inlay layers 116 and 118, also preferably formed of PVC, of respective thicknesses 0.1 mm and 0.15 mm, respectively. Alternatively, first, second and third inlay layers 114, 116 and 118 may be foamed of any other suitable material, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS.

A chip module 120 is mounted in a recess 122 formed in electronic interface card 100. The chip module preferably includes a packaged smart card chip 124 having pads 126 and an array 128 of contacts, preferably of thickness 0.06 mm. Alternatively, contacts 128 may be obviated and smart card chip 124 may provide contactless functionality.

Electrical connections between the chip module 120 and the embedded antenna 112 are provided by wires 130, preferably of thickness 0.1 mm, which are preferably soldered at first ends thereof to pads 126 and laser bonded at opposite ends thereof to metal elements 132 which are bonded to respective ends of wire antenna 112. It is a particular feature of the present invention that the length of wires 130 between pads 126 and respective metal elements 132 is substantially longer than the distance between pads 126 and metal elements 132 in the assembled card. This feature provides enhanced reliability.

A layer 134 of hot melt adhesive, disposed at the periphery of the underside of array 128 of contacts, retains the chip module 120 in recess 122, by engaging a corresponding recessed peripheral facing surface 136 of layer 106.

Reference is now made to FIG. 2, which is a simplified pictorial illustration of an initial step in the manufacture of the electronic interface card of FIG. 1 in which layer 114 is punched to define a pair of apertures 150. As see in FIGS. 3A and 3B, antenna 112 is associated with layer 114, as by known embedding techniques, typically employing an ultrasonic head commercially available from PCK Technology, Inc. of Islip, N.Y., U.S.A. Opposite ends 152 of antenna 112 terminate at apertures 150, as seen in FIGS. 3A and 3B.

Alternatively, antenna 112 may be a printed antenna formed on substrate 114 by suitable printing techniques or may be an antenna attached to substrate 114 by any suitable attachment method.

Turning now to FIGS. 4A and 4B, it seen that adhesive pads 154 are mounted onto layer 114 at corresponding edges 156 of apertures 150. As seen in FIGS. 5A and 5B, metal elements 132 are placed in apertures 150 and are retained in position therein by adhesive pads 154. Preferably the ends 152 of antenna 112 are connected to metal elements 132 by thermal-compression bonding or any other suitable technique. Following this connecting step, the adhesive pads 154 are no longer needed to retain the metal elements 132 in place and the pads 154 are removed. It is appreciated that alternatively adhesive-pads 154 need not be removed.

At this stage, as seen in FIGS. 6A and 6B, layers 116 and 118 are provided onto the underside of layer 114 and layers 102, 104, 106 and 108 are all laminated together therewith, with the resulting laminated structure appearing as shown in FIGS. 7A and 7B.

Turning now to FIGS. 8A and 8B, it is seen that recess 122 is fowled in layers 102, 106 and 114 and metal elements 132 and recessed peripheral facing surface 136 of layer 106 is exposed, preferably by milling. It is appreciated that alternatively the recess may be formed on the opposite surface of the card. As seen in FIGS. 9A and 9B, thin wires 130 are attached, preferably by laser bonding, to metal elements 132. The wires 130 are trimmed and preferably arranged to extend generally perpendicularly to layer 102.

Turning now to FIGS. 10A and 10B, it is seen that following attachment of wires 130 to corresponding pads 126 of the chip module 120, and placement of hot melt adhesive 134 on the periphery of the underside of array 128, the chip module 120 is inserted into recess 122 such that the periphery of array 128 sealingly engages recessed peripheral facing surface 136 of layer 106. The insertion method is such that wires 130 are folded underneath the chip module 120, as seen in FIG. 1.

It is appreciated that the methodology described hereinabove with respect to FIGS. 1-10B is preferably highly automated.

It is appreciated that while the illustrated embodiment described herein includes substrate layers 102, 104, 106, 108, 114, 116 and 118, the multiple-layer substrate of electronic interface card 100 may include any suitable number of layers of any suitable thickness.

It is also appreciated that any or all of the layers of the multi-layer substrate of electronic interface card 100 may be formed of any of the materials described hereinabove, or any other suitable material, such as a composite material. Additionally, the layers of the multi-layer substrate of electronic interface card 100 need not be formed of the same material and each layer may be formed of a different material or different materials.

It will be appreciated by persons skilled in the art that the scope of the present invention is not limited by what has been particularly shown and described hereinabove. Rather, the invention includes both combinations and subcombinations of the various features described hereinabove as well modifications and variations thereof which would occur to persons skilled in the art upon reading the foregoing description together with the drawings and which are not in the prior art. 

1. A method for manufacture of an electronic interface card comprising: defining a pair of apertures in a substrate layer; associating an antenna with said substrate layer such that opposite ends of said antenna terminate at said apertures; placing a metal element in each of said apertures; connecting said ends of said antenna to said metal elements; laminating said substrate layer together with a top layer and a bottom layer; forming a recess in said top layer and said substrate layer; attaching ends of connection wires to said metal elements; attaching opposite ends of said connection wires to a chip module; and sealing said chip module in said recess.
 2. A method according to claim 1 and also comprising providing a first additional substrate layer and a second additional substrate layer onto the underside of said substrate layer prior to said laminating.
 3. A method according to claim 1 and wherein said top layer comprises a first top substrate layer and a second top substrate layer.
 4. A method according to claim 3 and also comprising exposing a recessed surface of said second top layer adjacent said recess and wherein said sealing comprises: placing an adhesive on an underside of said chip module; and inserting said chip module into said recess such that said underside engages said recessed surface.
 5. A method according to claim 1 and also comprising folding said wires underneath said chip module.
 6. A method according to claim 1 and wherein said method is automated.
 7. A method according to claim 1 and wherein said attaching ends of connection wires to said metal elements comprises laser bonding.
 8. A method according to claim 1 and wherein said attaching opposite ends of said connection wires to a chip module comprises soldering.
 9. A method for manufacture of an electronic interface card according to claim 1 and wherein said wires have a length substantially greater than the distance between their respective opposite ends in said electronic interface card.
 10. A method for manufacture of an electronic interface card comprising: forming a substrate having at least one layer; forming an antenna in said at least one layer; forming a recess in said at least one layer; connecting wires between a chip module and said antenna; and mounting said chip module in said recess.
 11. A method for manufacture of an electronic interface card according to claim 10 and wherein said wires have a length substantially greater than the distance between their respective opposite ends in said electronic interface card.
 12. A method for manufacture of an electronic interface card according to claim 10 and wherein said connecting wires includes connecting said antenna to metal elements and connecting said wires to said metal elements.
 13. A method according to claim 10 and wherein said mounting comprising folding said wires underneath said chip module.
 14. A method according to claim 10 and wherein said method is automated.
 15. An electronic interface card comprising: a substrate; a wire antenna associated with said substrate; a chip module mounted in a recess formed in said substrate; and wires providing electrical connections between said chip module and said wire antenna.
 16. An electronic interface card according to claim 15 and wherein said chip module comprises a packaged smart card chip.
 17. An electronic interface card according to claim 15 and wherein said wires are folded underneath said chip module in said recess.
 18. An electronic interface card according to claim 15 and wherein said wires have a length substantially greater than the distance between their respective opposite ends in said electronic interface card.
 19. A system for manufacturing an electronic interface card based on an electronic interface assembly comprising a substrate having at least one layer, at least two metal elements located in said at least one layer and a wire antenna associated with said substrate and having ends electrically coupled to said at least two metal elements, the system comprising: a laminator operative to laminate said substrate layer together with a top layer and a bottom layer; a recess former operative to form a recess in said top layer and said substrate layer; a first wire attacher operative to attach ends of connection wires to said metal elements; a second wire attacher operative to attach opposite ends of said connection wires to a chip module; and a sealer operative to seal said chip module in said recess.
 20. A system for manufacturing an electronic interface card according to claim 19 and wherein said first wire attacher is a laser bonding wire attacher.
 21. A system for manufacturing an electronic interface card according to claim 19 and wherein said second wire attacher is a soldering wire attacher.
 22. An electronic interface assembly comprising: a substrate having at least one layer; at least two metal elements located in said at least one layer; and a wire antenna associated with said substrate and having ends electrically coupled to said at least two metal elements.
 23. A method for manufacture of an electronic interface assembly comprising: providing a substrate having at least one substrate layer; associating an antenna with said at least one substrate layer; and connecting opposite ends of said antenna to metal elements associated with said substrate.
 24. A method for manufacture of an electronic interface assembly according to claim 23 and also comprising: defining a pair of apertures in a substrate layer such that opposite ends of said antenna terminate at said apertures; and placing said metal elements in each of said apertures prior to said connecting.
 25. A method for manufacture of an electronic interface assembly according to claim 23 and also comprising laminating said substrate layer together with a top layer and a bottom layer.
 26. A method for manufacture of an electronic interface assembly according to claim 25 and also comprising: forming a recess in said top layer and said substrate layer; attaching ends of connection wires to said metal elements; attaching opposite ends of said connection wires to a chip module; and sealing said chip module in said recess.
 27. A method according to claim 26 and wherein said attaching ends of connection wires to said metal elements comprises laser bonding.
 28. A method according to claim 26 and wherein said attaching opposite ends of said connection wires to a chip module comprises soldering.
 29. A method according to claim 23 and wherein said method is automated.
 30. An electronic interface assembly comprising: a substrate having at least one layer; at least two terminals located in said at least one layer; a wire antenna associated with said substrate and having ends electrically coupled to said at least two terminals; a chip module mounted in a recess formed in said substrate; and wires providing electrical connections between said chip module and said wire antenna, said wires having a length substantially greater than the distance between their respective opposite ends in said electronic interface assembly.
 31. An electronic interface assembly according to claim 30 and wherein said chip module comprises a packaged smart card chip.
 32. An electronic interface assembly according to claim 30 and wherein said wires are folded underneath said chip module in said recess. 